Qualcomm Snapdragon 460 Specifications

Qualcomm Snapdragon 460 640 & 670 Specifications and Rumored Phone List

If you got excited about the new leaks on the Chinese website “Weibo,” we are too! The latest leak shows you a glimpse of whats coming shortly. What we got, for now, are the Qualcomm Snapdragon 460 640 & 670 Specifications. We should expect more in the next few months, so fingers crossed.

According to the latest leak from Weibo, Qualcomm is preparing three SoC platforms for 2018 – Snapdragon 670, Snapdragon 640 and Snapdragon 460. In this post, we have discussed the specifications of Snapdragon 460 and rumored phones that will be powered by it.

Related Reading: Snapdragon 635 vs. 636

Qualcomm Snapdragon 460 640 670 Specifications – “Leak”

Source: Weibo

Snapdragon is the successor of Snapdragon 450. This SoC will be equipped with affordable range smartphones. It will feature eight cores in total. Four Kryo cores are clocked at 1.8 GHz and four Kryo cores clocked at 1.4 GHz, but there is shared L3 cache. Kryo cores used in Snapdragon 460 are based on the Cortex-A75 and Cortex-A55.

It has the same X12 modem integrated as featured in Snapdragon 640, but with different ISP. The X12 LTE modem offers download speed of 600 Mbps and Upload speed of 150 Mbps.

It supports maximum up to 21 MP single camera with 14-bit spectra of 240 ISP. This chipset is fabricated on 14nm process technology. This chipset is expected to be paired with paired with Adreno 605 GPU.

Snapdragon 460 SoC is likely to debut this year at MWC along with SD 640 and SD 670, and after that, we will see the phones powered by them.

 Qualcomm Snapdragon 460 SoC Specifications
CPU 4 x Kryo 360 Silver (A55 derivative @ 1.83 GHz 4 x 64 KB L2)

4 x Kryo 360 Silver (A55 derivative @ 1.4 GHz 4 x 64 KB L2)

GPUAdreno 605
Memory 2 x 16-bit [email protected] 1866 MHz
LPDDR4x
14.9 GB/s
ISP/Camera 14-bit Spectra 240 ISP 21 MP
Integrated Modem Snapdragon X12 LTE (Category 12/13)

DL = 600 Mbps
3 x 20 MHz CA, 256-QAM

UL = 150 Mbps
2×20 MHz Ca, 64-QAM

Manufacturing Process 14 nm LPP

Rumored Phones with Qualcomm Snapdragon 460 SoC

Snapdragon 460 will be used in the affordable smartphones of 2018. It is going to be the most powerful processor for the budget-strained smartphones. Right now, we don’t have any leaks or rumors of any phone that will be powered by Snapdragon 460. But considering the performance of this SoC, soon there will be plenty of options available in the market. As soon as something comes up, we will update this post.

Qualcomm Snapdragon 640 SoC Specifications and Rumored Phones

The previous month, in December, Qualcomm took the wraps off the Snapdragon 845. It is so far the best SoC that Qualcomm has ever manufactured. But not everyone could buy flagship phones, so as per leaks from Weibo, Qualcomm is working on Snapdragon 640 SoC.

Snapdragon 640 will be the successor of Snapdragon 630. This time Qualcomm is showing us something that we have never seen before. SD 640 is 6+2 core combination processor. It has two Kryo 360 cores clocked at 2.15 GHz and six Kryo 360 cores clocked at 1.55 GHz.

This is possible due to the ARM’s DynamIQ, which allows mix and match of Cortex A75 and A55 CPU. This processor will be built on 10 nm fabrication process and features 1 MB system cache. It might be paired with Adreno 610 GPU. The leaked images suggest that Snapdragon 640 might uses the X12 LTE modem. The X12 LTE modem offers 600 Mbps download speed limit and 150 Mbps upload speed limit.

Snapdragon 640 SoC uses a dual 14-bit Spectra 260 ISP which will also be being featured in the Snapdragon 670. It can support up to the 26MP single camera or two 13MP cameras. This SoC will power the mid-tier smartphones that provide high-performance at the affordable price.

 Qualcomm Snapdragon 640 SoC Specifications
CPU4 x Kryo 360 Gold (A55 derivative @ 2.00 GHz 4 x 128 KB L2)

4 x Kryo 360 Silver (A55 derivative @ 1.6 GHz 4 x 128 KB L2)

1 MB L3

GPUAdreno 610
Memory3 x 16-bit [email protected] 1866 MHz
LPDDR4x
14.9 GB/s1 MB system cache
ISP/Camera Dual 14-bit Spectra 260 ISP 1 x 26 MP or 2 x 13 MP
Integrated Modem Snapdragon X12 LTE (Category 12/13)
DL = 600 Mbps
3 x 20 MHz CA, 256-QAM = 150 Mbps
2 x 20 MHz Ca, 64-QAM
Manufacturing Process 10 nm LPP

Upcoming Phones (Rumored) with Snapdragon 640 SoC

This SoC is expected to be unveiled in the first quarter of 2018, maybe in MWC. After that, we will see the phones with this powerful SoC, and we assure you to update this list at our earliest.

Qualcomm Snapdragon 670 SoC Specifications and Rumored Phones

As per leaks from the Weibo, out of the three Qualcomm SoCs that will be launched in 2018, the top one is Snapdragon 670. It will be the successor of Snapdragon 660. Snapdragon 670 will bring significant improvements to mid-range smartphones not just by performance but by efficiently saving the battery.

Snapdragon 670 packs a combination of Kryo 360 Gold and 360 Silver cores clocked in two different cluster configurations. It is an octa-core chip with dual quad-core clusters, four cores are clocked at 2.00 GHz, and four cores are clocked at 1.6 GHz with 2 MB system cache memory.

Snapdragon 670 will feature an X16 LTE modem with a download speed limit of 1000 Mbps and upload speed limit of 150 Mbps. As far as the camera capabilities are concerned, it uses the dual 14-bit Spectra 260 ISP supporting a single camera up to 26 MP and dual cameras up to 13 MP.

It is built using the Samsung’s 10 nm LPP process technology. This is the same technology that is also used in Snapdragon 835 and Exynos 8895 chips. This SoC will be paired with the Adreno 620 graphics processor. Qualcomm is also testing this SoC. Their test platform has 4/6 GB LPDDR4x RAm, 64 GN eMMC storage, and dual camera setup, as per another leak.

 Qualcomm Snapdragon 670 SoC Specifications
CPU4 x Kryo 360 Gold (A55 derivative @ 2.00 GHz 4 x 128 KB L2)

4 x Kryo 360 Silver (A55 derivative @ 1.6 GHz 4 x 128 KB L2)

1 MB L3

GPUAdreno 620
Memory 3 x 16-bit [email protected] 1866 MHz
LPDDR4x
22.4 GB/s2 MB system cache
ISP/CameraDual 14-bit Spectra 260 ISP 1 x 26 MP or 2 x 13 MP
Integrated ModemSnapdragon X16 LTE (Category 16/13)
DL = 1000 Mbps
3 x 20 MHz CA, 256-QAMUL = 150 Mbps
2 x 20 MHz Ca, 64-QAM
Manufacturing Process 10 nm LPP

No phone manufacturers have given any official confirmation about which phones will be powered by the Snapdragon 670, as the chip is still under testing. You have to wait for few more months to see the phones powered by the Snapdragon 670 SoC.

Conclusion

We are excited to see their custom Kryo cores being pushed to their low-end SOC’s. These should outperform anything that we had before, for the entry level, sub 300 dollar phones. We hope you like our article. Feedbacks and suggestions are welcome below in the comments section.

Disclosure: We are a professional review website that sometimes receive compensation or free units from the companies whose products we review. We test each product thoroughly and give high marks to only the very best. We are independently owned and the opinions expressed here are our own.