Intel’s Xeon 6900P series, also known as Granite Rapids, is a groundbreaking addition to server-grade processors.
With up to 128 performance cores (P-cores) and major upgrades in memory bandwidth and I/O capacity, these CPUs are tailored for high-performance computing (HPC), artificial intelligence (AI), and data-intensive applications.
Related: Best LGA 3647 Socket CPU Coolers
However, to unlock their full potential, selecting the right motherboard is essential. This guide outlines the critical features to look for in motherboards compatible with the Xeon 6900P series.
The Xeon 6900P family includes five main SKUs, ranging from 72 cores to 128 cores, with TDPs up to 500W. The lineup also introduces customized SKUs for hyperscalers, highlighting Intel’s adaptability.
| SKU | Cores | Threads | L3 Cache | TDP |
|---|---|---|---|---|
| 6980P | 128 | 256 | 504MB | 500W |
| 6979P | 120 | 240 | 480MB | 500W |
| 6960P | 72 | 144 | 432MB | 350W |
Xeon 6900P’s Place in Intel’s Server Strategy
The Xeon 6900P series is part of Intel’s broader Xeon 6 family, which includes both Granite Rapids-AP and Sierra Forest architectures. While the 6900P targets high-performance workloads with P-cores, Sierra Forest delivers efficiency with E-cores. This dual-strategy approach reflects Intel’s response to the diverse demands of modern data centers.
| Family | Focus Area | Core Type | Memory Channels | Target Workloads |
|---|---|---|---|---|
| Granite Rapids | High-performance computing | P-cores | 12 | HPC, AI, and data-heavy workloads |
| Sierra Forest | Cloud-native and scale-out | E-cores | 6 | Scale-out, energy-efficient setups |
Socket and Chipset Compatibility
The Xeon 6900P processors are built for the LGA 7529 socket, a platform designed to handle their high core counts and power demands. With a TDP of up to 500W, these CPUs require motherboards that can manage intense thermal and electrical loads. The Birch Stream platform supports these processors, offering a scalable and robust infrastructure for server applications.
Memory Support
A standout feature of the Xeon 6900P series is its support for 12 channels of DDR5 memory. These processors natively handle DDR5-6400 speeds and are compatible with MCR (Multiplexer Combined Ranks) DIMMs, which can push speeds up to DDR5-8800. This enhanced memory bandwidth is a game-changer for demanding workloads. Motherboards must support this 12-channel architecture and accommodate the higher speeds offered by MCR DIMMs.
I/O and Expansion Capabilities
The Xeon 6900P processors offer 96 lanes of PCIe 5.0, delivering unparalleled bandwidth for high-speed peripherals. This makes them ideal for systems with multiple GPUs, NVMe storage devices, or advanced network interface cards. Additionally, support for Compute Express Link (CXL) 2.0 is essential, as it allows for advanced memory pooling and accelerator sharing, which boosts flexibility and performance.
Power Delivery and Thermal Management
With their high power requirements, Xeon 6900P processors demand motherboards equipped with advanced power delivery systems, such as multi-phase VRMs (Voltage Regulator Modules). Efficient cooling solutions, including large heatsinks or liquid cooling setups, are also critical for maintaining stability and performance during heavy workloads.
Management and Security Features
Enterprise systems need reliable management and security tools. Motherboards designed for the Xeon 6900P series should include Intel Trusted Execution Technology (TXT) and Total Memory Encryption (TME) for robust data protection. Integration with Intel Active Management Technology (AMT) further enhances remote management capabilities, making these motherboards ideal for large-scale deployments.
Notable Motherboard Example
A strong example of a motherboard designed for the Xeon 6900P is the ASRock Rack GNRAPD12DNO. This model features:
- 12 DIMM slots for DDR5 RDIMM, RDIMM-3DS, and MCR DIMMs.
- 8 MCIO slots (PCIe 5.0 / CXL 2.0 x8), 2 M.2 slots (PCIe 5.0 x4), and an OCP NIC 3.0 slot (PCIe 5.0 / CXL 2.0 x16).
- Remote management support through IPMI.
These features make it an excellent choice for enterprise systems requiring flexibility and high performance.
It is crucial to find the right motherboard for the Xeon 6900p to obtain optimal performance. Generally, these boards support the LGA 3647 socket to be compatible with Xeon 6900p processors. Besides, they are commonly used for high-end servers or workstations.
List of Motherboards for Intel Xeon 6900P & 6700E Processors:
| Image | Product Name | Buy Now |
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AsRock GNRAPD12DNO |
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ASRock Rack GNRD8-2L2T (6700E Only) |
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Intel Avenue City
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Intel Avenue City
This platform serves as a validation reference design for Intel’s upcoming Xeon 6900P-series processors, featuring LGA 7529 sockets, support for DDR5-6400 or 8800 MT/s MRDIMM/MCR DIMM memory, and 12 memory channels for unparalleled performance.
It is built to support Intel’s next-generation Xeon processors, including the Sierra Forest and Granite Rapids series. Designed for efficiency and high performance, this platform is well-suited to handle demanding workloads such as artificial intelligence (AI), high-performance computing (HPC), and cloud-scale applications.
With a 20-layer PCB design and support for 24 DDR5 memory slots, this platform sets new standards. It is expected to accommodate faster DDR5 memory with speeds of up to 6400 MT/s in a 1SPC/1DPC configuration, a significant improvement over previous platforms like Emerald Rapids (5600 MT/s) and Sapphire Rapids (4800 MT/s).
This platform is designed to host two distinct CPUs: the Granite Rapids and the Sierra Forest. Granite Rapids focuses entirely on high-performance cores, making it ideal for compute-intensive applications such as scientific research or financial modeling. Meanwhile, Sierra Forest leverages an efficient “Atom” architecture, tailored for energy-sensitive workloads in sectors like IoT or telecommunications.
Both processors are built on Intel 3 process technology, ensuring cutting-edge performance and energy efficiency. Together, these CPUs provide tailored solutions for industries demanding either extreme computing power or optimized energy efficiency, highlighting the platform’s versatility and next-gen capabilities.
Specifications:
| Socket | LGA 7529 (Socket BR) |
| Dimensions | 42.4 x 50.8 cm |
| PCB Layers | 20-layer design |
| Memory Slots | 24 DDR5 DIMM slots |
| Memory Support | Up to 12-channel DDR5 memory, with speeds up to 6400 MT/s in a 1SPC/1DPC configuration and up to 8000 MT/s with MCR (Multiplexer Combined Ranks) |
| CPU Support | Granite Rapids-AP and Sierra Forest-AP CPUs, with up to 500W TDP |
| PCIe Support | 6 PCIe Gen 5 x16 links (Gen5/CXL), 6×24 UPI links |
| M.2 Slots | 2 PCIe x2 M.2 slots, 1 PCIe x2 M.2 (2280) Module |
| I/O Ports | Rear USB 3.0 + USB 2.0 ports, Serial Port (Type-C), Mini DP, Gigabit Ethernet switch for management, TPM 2.0, RunBCM Module (AST2600), SPI TOM Module conn, PFR 4.0 |
| Chassis Support | 2S Open Chassis Standard EGS POK and 2S 4U closed chassis (Rich AIC) |
ASRock Rack GNRD8-2L2T: (6700E Only)
Specifications:
| Form Factor | CEB |
| Size | 12″ x 10.5″ |
| CPU | Supports Intel® Xeon® 6700E-series processors |
| Socket | 1 Socket E2 (LGA 4710) |
| Chipset | System on Chip |
| Capacity | 8 DIMM slots (1DPC) |
| Type | DDR5 RDIMM |
| DIMM Size Per DIMM | RDIMM: 128GB |
| Max. DIMM Frequency | RDIMM: 6400MT/s |
| Voltage | 1.1V |
| PCIe x 16 |
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| TPM support |
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| Additional GbE Controller | 2 RJ45 (10GbE) by Intel® X710-AT2, 2 RJ45 (1GbE) by Intel® i210 |
| BMC Controller | ASPEED AST2600: IPMI2.0 with iKVM and vMedia support |
| IPMI Dedicated GLAN | 1 Realtek RTL8211F for dedicated management GLAN |
| Controller | ASPEED AST2600: 1 DB15 (VGA), 1 (15-pin) header |
| Rear I/O panel |
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| Internal Connectors |
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| Onboard LED |
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| BIOS type | UEFI BIOS AMI; 512Mb SPI Flash ROM |
| BIOS features | Plug and Play, ACPI 4.0 and above compliance wake-up events, SMBIOS 3.4 and above, ASRock Rack instant flash. |
| Monitoring features |
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AsRock GNRAPD12DNO:
This ASRock motherboard is not only built for powerful performance but also tailored for practical, real-world applications. It features eight hot-swappable E1.S (PCIe 5.0 x4) drive bays, allowing users to replace drives seamlessly without shutting down the system.
For enhanced network capabilities, it includes a PCIe 5.0 x16 slot and an OCP NIC 3.0 slot, ensuring high data transfer speeds and minimal latency. These features make it an excellent choice for businesses in content delivery networks or storage services, where reliability and performance are critical. Additionally, the motherboard is designed to maximize throughput, pairing its high-speed connectivity with robust computing power for demanding workloads.
Specifications:
| Form Factor | M-DNO Type 2 |
| Dimensions | 210 mm x 305.59 mm |
| CPU | Supports Intel® Xeon® 6900P-series processors |
| Socket | 1 Socket BR (LGA 7529) |
| Chipset | System on Chip |
| Supported DIMM Quantity | 12 DIMM slots (1DPC) |
| Supported Type | DDR5 RDIMM, RDIMM 3DS, MCR DIMM |
| Max. Capacity per DIMM | RDIMM: 128GB; RDIMM 3DS: 256GB; MCR DIMM: 256GB |
| Max. DIMM Frequency | RDIMM: 6400 MT/s; RDIMM 3DS: 6400 MT/s; MCR DIMM: 8800 MT/s |
| Voltage | 1.1V |
| TPM support | 1 (13-pin, SPI) |
| Other PCIe expansion connectors | M.2 slot: 2 M-key (PCIe5.0 x4), supports 2280 form factor
Others: 8 MCIO (PCIe5.0 / CXL2.0 x8) |
| Ethernet | OCP slot: 1 OCP NIC 3.0 (PCIe5.0 x16) |
| Server management | BMC Controller: ASPEED AST2700 on DC-SCM 2.0 module (DC_SCM_2700)
IPMI Dedicated GLAN: 1 Realtek RTL8211F for dedicated management GLAN on DC-SCM 2.0 module (DC_SCM_2700) |
| Graphics controller | ASPEED AST2700: 1 Mini DisplayPort (on DC_SCM_2700) |
| Rear I/O | UID Button/LED: 1x UID button/LED on DC_SCM 2.0 module (DC_SCM_2700)
Serial Port: 1x Type-C (COM) on DC-SCM 2.0 module (DC_SCM_2700) VGA Port: 1x Mini DisplayPort on DC_SCM 2.0 module (DC_SCM_2700) USB 3.2 Gen1 Port: 2x Type-A (USB3.2 Gen1) on DC-SCM 2.0 module (DC_SCM_2700) RJ45: 1x dedicated IPMI on DC-SCM 2.0 module (DC_SCM_2700) |
| Internal connector/headers | Power Connector: 2x 12V PICPWR (24-pin, 12V 2X6+12 Sideband)
Auxiliary Panel Header: 1 (19-pin): UID switch w/LED, power switch w/LED, SMbus, HDD activity LED, system fault LED TPM Header: 1 (13-pin, SPI) System Panel: 1 (20-pin): SMBus, USB2, SPI, Sideband Other connectors: 1 (13-pin, SPI) TPM Header 1x VROC header, 1x HSBP, 1x SMBus header, 1x PMBus header, 1x IPMB Header, 1x Clear CMOS (contact pads), 1 (PDB Management Connector), 1x NMI header |
| LED indicators | 1 (3VSB) Standby PWR LED, 1x 80 Debug Port LED, BMC heartbeat LED: 1 on DC-SCM 2.0 module (DC_SCM_2700), 1 CPLD heartbeat LED |
| System BIOS | BIOS Type: AMI UEFI BIOS; 512MB SPI Flash ROM
BIOS Features: Plug and Play, SMBIOS 3.4 and above, ACPI 4.0 and above compliance wake-up events, ASRock Rack Instant Flash |
| Hardware Monitor features | Fan: Fan Tachometer; CPU Quiet Fan (can automatically adjust Chassis Fan Speed by CPU Temperature); Fan Multi-Speed Control
Temperature: CPU, MB, M.2, Card Side, RAM, TR Temperature Sensing Voltage: PVCCD0_HV_CPU0, PVCCD1_HV_CPU0, PVCCINF_CPU0, PVCCIN_CPU0, PVCCFA_EHV_FIVRA_CPU0, PVNN_TERM_CPU0, 3.3V, 5V, 12V, 1.8V_AUX, PVCCFA_EHV_CPU0, +3VSB, +5VSB, +12VSB |
Conclusion
The Intel Xeon 6900P series is a major leap in server processor technology, but the right motherboard is key to unlocking its full potential. Features like socket compatibility, memory support, I/O capabilities, power delivery, and management tools should guide your selection process. By choosing a well-suited motherboard, organizations can maximize the performance of the Xeon 6900P processors and ensure their systems are ready for the most demanding workloads.